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c型焊锡丝对助焊剂的性能要求

C型焊锡丝对助焊剂的性能要求
Performance requirements of C solder wire for flux
 
1、具有良好的助焊能力或化学活性,能够去除母材和焊料表面的氧化膜,降低焊料表面张力,防止再氧化等。
 
1、It has good soldering ability or chemical activity. It can remove the oxide film on the surface of the base metal and solder, reduce the surface tension of the solder and prevent re oxidation.(焊锡丝)
 
2、具有良好的润湿性,对焊料的扩展具有促进作用,保证较好的焊接效果。
 
2、 It has good wettability and promotes the expansion of solder to ensure better welding effect.
 
3、具有良好的热稳定性,保证c型焊锡丝在较高焊锡温度下的高活性。
 
3、It has good thermal stability to ensure high activity of C solder wire at higher solder temperature.(焊锡丝)
 
4、焊接时尽可能无锡珠和飞溅产生,也尽可能不释放有毒或有刺激性味道的气体。
 
4、 welding as far as possible Wuxi beads and spatter, and also do not release toxic or irritating flavor as much as possible.
 
5、焊接后不粘手,焊后不易拉尖。
 
5、 The hand is not sticky after welding, and it is not easy to pull after welding.(焊锡丝)
 
6、留存于基板的残留物少且易清洗,对焊后材质无腐蚀性、不吸湿、不影响材质的电性能,具有良好的电气绝缘性能。
 
6、The residue remaining on the substrate is less and easy to clean. The material has no corrosion, no moisture absorption, and does not affect the electrical properties of the material. It has good electrical insulation performance.
 
7、常温下易储存,性质稳定。
 
 
7、 It is easy to store at room temperature, and its properties are stable.(焊锡丝)
 
8、黏度、比重应比c型焊锡丝小,焊剂黏度大会加大润湿扩散的难度。
 
8、 viscosity and specific gravity should be smaller than that of type C solder wire. The flux viscosity will increase the difficulty of wetting diffusion.
 
实际上,生产和应用的助焊剂不可能完全同时完美地满足以上要求,因此在实际生产中应该根据焊锡丝的工艺需求,合理选择不同类型和特点的助焊剂。
 
In fact, the flux of the production and application can not meet the requirements perfectly at the same time. Therefore, in actual production, the welding flux of different types and characteristics should be selected reasonably according to the technological requirements of the solder wire(焊锡丝)
 
焊锡丝
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